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DSMB 172 57360001-GH ABB Memory BoardDSMB 172 57360001-GH ABB Memory BoardDSMB 172 57360001-GH ABB Memory Board
DSMB 172 57360001-GH ABB Memory Board
DSMB 172 57360001-GH ABB Memory Board
DSMB 172 57360001-GH ABB Memory Board

DSMB 172 57360001-GH ABB Memory Board


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PRODUCT SKU : DSMB 172 57360001-GH

PRODUCT TYPE : Memory Modules

PRODUCT VENDOR : ABB


  • 100% Genuine Parts – Risk-Free 30-Day Returns
  • 1-Year Warranty & Expert Support for Every Order

Product Details

The ABB DSMB 172 57360001-GH, also cataloged as the DSMB 172 Memory Board, operates as a dedicated hardware component for signal processing and bus data exchange within Bailey Infi 90 and Symphony DCS racks.

Hardware Specifications

Parameter Specification
Model DSMB 172 57360001-GH
Brand ABB
Origin Standard ABB Manufacturing Facility
Weight 0.5 kg
Dimensions 300 x 30 x 180 mm
Operating Temp -20 to 60 deg C
Power Consumption 24 VDC Control Supply
Primary Function Signal Processing and Communication Board
System Compatibility ABB Bailey Infi 90 / Symphony DCS Racks
Mounting Type Standard Rack Slot Insertion

Backplane Communication Velocity and Deterministic Control Integration

The DSMB 172 card interfaces directly with the system rack backplane, preserving high communication velocity across process control nodes. The memory module design maintains deterministic network timing across field bus interfaces and supports seamless firmware flash compatibility during controller boot cycles. Optimized for I/O density scaling, the board executes real-time data storage without introducing bus contention on local DCS racks.

Frequently Asked Questions

Q: What power input is required to operate the memory board?

A: The board operates on a 24 VDC control power supply delivered through the backplane rack assembly.

Q: Can the DSMB 172 board be hot-swapped during active controller operation?

A: Hot-swapping depends on system backplane configuration; field engineers must verify rack bus isolation requirements before extracting or inserting modules to avoid bus disruption.

Q: How is thermal dissipation handled within high-density rack enclosures?

A: The 30 mm slim form factor allows vertical convective air movement through standard rack slots to maintain operating temperatures within the specified -20 to 60 deg C ambient limits.

Field Installation Guidelines

  1. Power Isolation: Turn off supply power to the target rack card cage before inserting or removing the printed circuit board assembly.
  2. ESD Protection: Wear an earth-grounded wrist strap during handling to prevent static discharge damage to memory integrated circuits.
  3. Card Alignment: Align the board edges with the top and bottom rack guide rails, pushing firmly until the backplane edge connector fully seats.
  4. Fastener Securing: Tighten the front panel retention screws to maintain a stable low-impedance connection with the rack grounding frame.

Additional Information

  • 100% Genuine Parts: All products are original and authentic, ensuring reliable industrial performance.
  • 30-Day Refund Guarantee: Return any in-stock item within 30 days in original, unopened packaging for a full refund (excluding shipping and fees).
  • 12-Month Warranty: Covers defects in materials or workmanship; excludes misuse, normal wear, or unauthorized modifications.
  • Worldwide Shipping: We ship via USPS, UPS, FedEx, and DHL. Delivery times vary by country and may be subject to customs or import fees.
  • Support & Contact: Technical and warranty assistance is available anytime. Contact us here: Contact.
  • Purchase Guidance: Check product specifications and compatibility carefully before ordering to ensure proper application.




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