Product Details
The Triconex 8112, also cataloged as the 8112 Remote Expansion Chassis, operates as a dedicated hardware component for high-density I/O module housing and system bus distribution within Tricon safety system platforms.
Hardware Specifications
| Parameter | Specification |
|---|---|
| Model | 8112 |
| Brand | Triconex |
| Origin | USA |
| Weight | 24.5 kg |
| Dimensions | 48.3 cm x 57.8 cm x 45.1 cm |
| Operating Temp | Not specified (Refer to system thermal derating) |
| Power Consumption | Dependent on installed I/O module load |
| Chassis Fabrication | Black zinc-plated, welded cold-rolled steel |
| Capacity | High-density modular slots |
Triple Modular Redundancy (TMR) Architectural Integration
The Triconex 8112 is engineered to support the physical implementation of the TMR 2oo3 architecture. The chassis backplane facilitates the necessary inter-module communication paths required to maintain triple-redundant signal processing. By providing standardized mechanical slots and bus connectivity, the chassis ensures that each redundant leg of the TMR system remains electrically isolated and mechanically secure. The fabrication of cold-rolled steel provides the structural rigidity required for high-density deployments, while the integrated backplane design supports the high-speed data exchange necessary for real-time fault detection and continuous fail-safe state execution across the safety system.
Frequently Asked Questions
Q: Can the 8112 chassis accommodate different types of I/O modules simultaneously?
A: Yes, the chassis backplane is designed to support mixed-module configurations, including analog and digital I/O, provided they adhere to the Tricon power and slot-assignment requirements.
Q: Is the 8112 chassis capable of hot-swapping modules during operation?
A: Yes, the system architecture allows for the removal and insertion of modules within the 8112 chassis while the system is powered and operational, provided the specific module type is designated for hot-swap capability.
Field Installation Guidelines
- Ensure the chassis is mounted into a standard 19-inch rack with adequate clearance for airflow to maintain proper thermal dissipation.
- Verify that the chassis frame is bonded to a dedicated ground bus to maintain EMC integrity and protection against common-mode noise.
- Install the power supply modules prior to loading the I/O modules to ensure the backplane is energized correctly.
- When securing the chassis to the rack, ensure all mounting bolts are tightened to specified torque values to prevent vibration-induced mechanical stress.
- Inspect all backplane connectors for debris or contact oxidation prior to seating any modules to ensure low-resistance system bus communication.
Additional Information
- 100% Genuine Parts: All products are original and authentic, ensuring reliable industrial performance.
- 30-Day Refund Guarantee: Return any in-stock item within 30 days in original, unopened packaging for a full refund (excluding shipping and fees).
- 12-Month Warranty: Covers defects in materials or workmanship; excludes misuse, normal wear, or unauthorized modifications.
- Worldwide Shipping: We ship via USPS, UPS, FedEx, and DHL. Delivery times vary by country and may be subject to customs or import fees.
- Support & Contact: Technical and warranty assistance is available anytime. Contact us here: Contact.
- Purchase Guidance: Check product specifications and compatibility carefully before ordering to ensure proper application.
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