GE IC200MDL750H VersaMax Discrete Output Module

The GE IC200MDL750H, also cataloged as the IC200MDL750 Discrete Output Module, operates as a dedicated hardware component for 12/24 VDC solid-state switching and direct actuator load drive within GE VersaMax control platforms.

Hardware Specifications

Deterministic Network Execution & Backplane Velocity

The IC200MDL750H transfers digital logic states across the VersaMax backplane bus, drawing up to 90 mA from the backplane power supply rail. Internal driver circuits process 32 sourcing-type outputs organized into two isolated groups of 16 channels, providing fast response times of 0.2 ms ON and 1.0 ms OFF.

Integration into Profinet / EtherNet/IP deterministic networks via primary communication interfaces guarantees low network latency and rapid update rates across local and expanded racks. System-wide firmware flash compatibility maintains consistent cycle timing during real-time scan execution, enabling seamless I/O density scaling across complex multi-chassis architectures.

Frequently Asked Questions

Q: Does the IC200MDL750H module feature internal overcurrent fusing on the output channels?

A: No. The IC200MDL750H contains no internal output fuses. External fuse protection must be provided on field wiring lines to prevent circuit damage from short circuit conditions.

Q: What are the backplane current draw and external field power requirements for this module?

A: The logic interface draws a maximum of 90 mA from the rack backplane power supply, while output loads require an external nominal 12/24 VDC (10.2 to 30 VDC) field power source.

Q: What inrush current capacity can an individual output point tolerate?

A: Each individual output point can handle a maximum surge inrush current of 2.0 A for up to 100 ms during inductive or lamp load switching.

Field Installation Guidelines

1. Power Shutdown: De-energize all primary rack backplane power supplies and external 12/24 VDC field power sources prior to module mounting or terminal carrier handling.
2. DIN-Rail Mounting: Mount the module carrier onto a standard 35 mm DIN rail, securing all panel grounding clips to maintain proper cabinet chassis earth connection.
3. Field Wiring Procedure: Connect external 10.2 to 30 VDC positive logic supplies to the field power input terminals. Route individual channel conductors to loads using appropriate wire gauges.
4. Inductive Suppression: Install external flyback diodes or RC suppression networks directly across inductive field loads (such as DC solenoids or contactor coils) to suppress voltage transients.
5. ESD Safeguards: Wear a grounded anti-static wrist strap connected to a clean cabinet metallic earth during installation to prevent static damage to logic components.