Product Details
The ICS Triplex T8110B, also cataloged as the T8110B Trusted TMR Processor Module, operates as a dedicated hardware component for safety logic execution within T8100 chassis platforms. Executing logic across a triple redundant Inter-Module Bus, the unit processes application code via a 100 MHz clock rate paired with 16 MB EDO DRAM and 128 kB NVRAM variable memory.
Hardware Specifications
| Parameter | Specification |
|---|---|
| Model | T8110B |
| Brand | ICS Triplex |
| Origin | United Kingdom |
| Weight | 2.94 kg (6.48 lb) |
| Dimensions | 266 mm x 93 mm x 303 mm (10.5 in x 3.6 in x 12.0 in) |
| Operating Temp | 0 deg C to +60 deg C (+32 deg F to +140 deg F) |
| Power Consumption | 80 W Maximum Load (Heat Dissipation: 80 W) |
| Voltage Range | 20 VDC to 32 VDC |
| Compatible Chassis | T8100 |
| Processor Clock | 100 MHz |
| Memory Configuration | 16 MB EDO DRAM (60 ns), 2 MB FLASH, 512 kB EPROM, 128 kB NVRAM |
| SOE Buffer Capacity | 1000 events (transfers to CI buffer of 4000 events) |
| Retained Variable Storage | Booleans: 1 byte, Analogues: 4 bytes, Timers: 5 bytes |
| I/O Interface | Triple redundant Inter-Module Bus |
| Relative Humidity | 10% to 95% non-condensing |
High-Reliability Safety Control & TMR Architecture
The T8110B implements a triple modular redundancy (TMR) 2oo3 architecture to satisfy SIL3 certification criteria across high-availability safety applications. Fault-tolerant processing circuits execute synchronized 2oo3 voting across internal bus lanes, guaranteeing fail-safe state execution without interruption to active control loops. Galvanic isolation throughout system interfaces prevents localized electrical transients from crossing bus boundaries, maintaining determinism during high-density I/O scan cycles.
Frequently Asked Questions
Q: How are retained variables allocated within the T8110B non-volatile memory structure?
A: Retained variable memory uses specific footprint allocations: 1 byte per Boolean variable, 4 bytes per Analogue variable, and 5 bytes per Timer variable within the 128 kB NVRAM space.
Q: What is the sequence of events (SOE) storage architecture on the processor module?
A: The T8110B maintains an onboard SOE buffer capacity of 1000 events, which automatically transfers logged event records to a Communications Interface (CI) buffer capable of storing up to 4000 events.
Q: Can the T8110B processor module be deployed in secondary expansion chassis?
A: No. The T8110B processor module is designed specifically for operation inside the primary T8100 system chassis.
Field Installation Guidelines
- Ensure the T8100 chassis backplane power is verified within the 20 VDC to 32 VDC supply tolerance before inserting the module.
- Torque the top and bottom chassis module retention screws to ensure positive frame ground contact and mechanical latching to the backplane connectors.
- Maintain unrestricted vertical airflow above and below the T8100 chassis slot to dissipate up to 80 W of thermal load during full logic processing.
- Verify system earthing connections to mitigate high-frequency ground noise that could affect time synchronization across the triple redundant bus.
Additional Information
- 100% Genuine Parts: All products are original and authentic, ensuring reliable industrial performance.
- 30-Day Refund Guarantee: Return any in-stock item within 30 days in original, unopened packaging for a full refund (excluding shipping and fees).
- 12-Month Warranty: Covers defects in materials or workmanship; excludes misuse, normal wear, or unauthorized modifications.
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- Purchase Guidance: Check product specifications and compatibility carefully before ordering to ensure proper application.































