Product Details
The GE IS200REBFH1ACA, also cataloged as the IS200REBF Printed Circuit Board, operates as a dedicated hardware component for voltage limiting and bus signal protection within GE Mark VI Speedtronic control system racks.
Hardware Specifications
| Parameter | Specification |
|---|---|
| Model | IS200REBFH1ACA |
| Brand | GE / General Electric |
| Origin | USA |
| Operating Temp | -30 to +65 deg C |
| Power Consumption | Rack Backplane Powered |
| Board Type | REBF Circuit Board Assembly |
| PCB Coating | Conformal Coated |
| Functional Revision | Revision A (IS200REBFH1A Base Revision) |
| System Compatibility | GE Mark VI Speedtronic Control System |
Backplane Bus Communication Velocity and Firmware Flash Compatibility
The IS200REBFH1ACA utilizes voltage-limiting hardware components to absorb transient overvoltage conditions before they reach high-speed bus lines. By maintaining stable logic potential across the rack slot interfaces, the module protects backplane bus communication velocity during electrical switching events. Onboard trace routing and passive components uphold consistent signal integrity across the Mark VI rack, preserving system timing sync and I/O density scaling without requiring firmware updates on the module itself.
Frequently Asked Questions
Q: Does the IS200REBFH1ACA board require independent external power wiring?
A: No. Operating power for the IS200REBFH1ACA board is supplied directly from the Mark VI rack backplane connectors upon insertion.
Q: What environmental protection is applied to the IS200REBFH1ACA circuit board?
A: The board features a conformal coating layer designed to protect surface-mount components and conductive traces against atmospheric moisture, industrial dust, and chemical contaminants.
Field Installation Guidelines
- Power down and isolate all electrical feeds to the Mark VI control rack before servicing hardware.
- Wear an anti-static wrist strap clipped to the cabinet earth ground point to protect electronic components from static discharge.
- Align the IS200REBFH1ACA card edges with the card guide tracks in the designated rack slot.
- Push the board firmly into the slot until the rear edge multi-pin connectors mate securely with the backplane socket.
- Tighten the top and bottom retaining screws to secure the front panel to the rack frame and ensure grounding continuity.
- Re-energize system power and inspect status LEDs on adjacent controller modules to confirm healthy system initialization.
Additional Information
- 100% Genuine Parts: All products are original and authentic, ensuring reliable industrial performance.
- 30-Day Refund Guarantee: Return any in-stock item within 30 days in original, unopened packaging for a full refund (excluding shipping and fees).
- 12-Month Warranty: Covers defects in materials or workmanship; excludes misuse, normal wear, or unauthorized modifications.
- Worldwide Shipping: We ship via USPS, UPS, FedEx, and DHL. Delivery times vary by country and may be subject to customs or import fees.
- Support & Contact: Technical and warranty assistance is available anytime. Contact us here: Contact.
- Purchase Guidance: Check product specifications and compatibility carefully before ordering to ensure proper application.
Tech & Buying Guide
Transforming Shop Floor Data into Actionable Insights: A Deep Dive into MES
Manufacturing Execution Systems serve as the digital backbone of modern factory floors. Positioned at Level 3 of the ISA-95 automation pyramid, MES links enterprise resource planning with real-time shop floor control systems. Today, industrial operators rely on MES software to bridge operational strategy with physical production execution.
Managed Switch vs. Unmanaged Switch: Industrial Ethernet Architecture
Hot Standby vs. Cold Standby Redundancy in Industrial Automation
System availability determines process safety and productivity in industrial automation. Control engineers deploy redundancy to eliminate single points of failure. This technical guide evaluates Hot Standby vs. Cold Standby architectures, comparing failover speeds, memory sync, cost trade-offs, and field selection criteria.