Product Details
Configured for discrete state actuation in VMEbus networks, the GE VMIVME-2170A 332-102170-110 (VMIVME-2170A Digital Output Board) provides direct physical/electrical execution.
Hardware Specifications
| Parameter | Specification |
|---|---|
| Model | VMIVME-2170A 332-102170-110 |
| Brand | GE Fanuc |
| Origin | United States |
| Weight | Standard Double Eurocard Weight |
| Dimensions | Double Eurocard Format with Front Panel |
| Operating Temp | 0 - 60 deg C |
| Power Consumption | VMEbus Backplane Rails Dependent |
| Output Count | 32 optically isolated outputs |
| Drive Current | 2.5 mA or 300 mA options |
| Voltage Tolerance | Up to 30 VDC in normal mode |
| Isolation Rating | 1 kV sustained / 6 kV pulsed |
| Bus Addressing | 14-bit board selection via onboard DIP switches |
| Data Transfer Width | 8-bit or 16-bit parallel transfers |
Backplane Bus Communication Velocity and Register Constraints
The module maps its 32 discrete output channels into the VMEbus system space using a 14-bit base address chosen by hardware DIP switches. Data write cycles support 8-bit or 16-bit transfer widths over the backplane bus interface. To prevent bus timeouts and maximize data throughput, internal logic registers update output states instantaneously. Mismatches in backplane timing parameters or firmware flash compatibility will interrupt data synchronization, forcing a master processor bus error.
Frequently Asked Questions
Q: Can the VMIVME2170A card be plugged or unplugged while the VME chassis is live?
A: No. The parallel backplane J1/J2 architecture does not incorporate pre-charging pins or staggered ground trace structures to handle live insertion. Hot-swapping the hardware will generate electrical transients that can damage the logic arrays.
Q: How do the two distinct output drive options (2.5 mA and 300 mA) alter terminal allocation?
A: The drive capacity depends on the physical trace layout and internal optocoupler configurations chosen during component layout setup. Load currents exceeding 300 mA will trigger thermal faults and destroy the affected channel isolation barrier.
Field Installation Guidelines
- Base Address Assignment: Configure the 14-bit address space via the onboard DIP switches before inserting the card into the rack. Cross-reference the system map to prevent address overlap with other VME modules.
- Chassis Engagement: Align the card rails with the Double Eurocard guides. Push smoothly until the connectors sit inside the backplane receptacle. Fasten the top and bottom front panel screws to ensure solid structural grounding.
- Field Shielding Practices: Wire the 32 discrete outputs using shielded cables separated from alternating current (AC) power grids. Attach cable shields to a single grounding bar within the main enclosure to eliminate ground loop currents.
Additional Information
- 100% Genuine Parts: All products are original and authentic, ensuring reliable industrial performance.
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- 12-Month Warranty: Covers defects in materials or workmanship; excludes misuse, normal wear, or unauthorized modifications.
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- Purchase Guidance: Check product specifications and compatibility carefully before ordering to ensure proper application.































