Product Details
The GE IC200CHS003K, also cataloged as the IC200CHS003 Input/Output Carrier, operates as a dedicated hardware component for field signal termination and backplane interface mounting within GE VersaMax control networks.
Hardware Specifications
| Parameter | Specification |
|---|---|
| Model | IC200CHS003K |
| Brand | GE (GE Fanuc / Emerson) |
| Origin | USA |
| Weight | 0.11 kg (0.25 lbs) |
| Power Consumption | Passive backplane power routing |
| Wiring Termination Style | Connector style (36-pin connector) |
| Max I/O Points | Up to 32 input/output points |
| Rated Current Per Point | 2 A per point |
| Rated Current Power/Ground | 8 A per power and ground connection |
| Transient Voltage Rating | 300 VAC maximum |
| Contact Resistance | Less than 10 milliohms |
| Degree of Protection | IP20 |
| Housing Material | ABS plastic |
| Mounting Type | DIN rail mount (Vertical orientation) |
Deterministic Network Execution & Backplane Velocity
The IC200CHS003K carrier provides the physical backplane interface and structural mounting base for VersaMax I/O modules, establishing high-velocity backplane bus communication routes directly to the main CPU or interface unit. By managing up to 32 I/O points via an integrated 36-pin field connector, the carrier maintains contact resistance below 10 milliohms to preserve signal fidelity during real-time data acquisition cycles.
Full compatibility with Profinet / EtherNet/IP deterministic networks is achieved when paired with active network interface modules, facilitating flexible I/O density scaling across expanded rail assemblies. The mechanical architecture enforces tight firmware flash compatibility across installed field modules while providing up to 4 common power connections rated for 8 A power and ground distribution.
Frequently Asked Questions
Q: What is the maximum current capacity for individual I/O channels and power terminals on the IC200CHS003K carrier?
A: Individual I/O points are rated at 2 A per channel, while common power and ground connections support up to 8 A per point.
Q: How are field wiring connections terminated on the IC200CHS003K module?
A: Field connections are established via an integrated 36-pin connector, enabling direct harness connection rather than individual screw terminal wiring.
Q: Is live insertion or extraction of I/O modules supported on this carrier?
A: Hot-swapping depends on the system controller and module capabilities; field power and backplane supply must be isolated if non-hot-swappable modules are mounted on the carrier.
Field Installation Guidelines
- Power Isolation: Disconnect and lock out all 24 VDC/120 VAC field power and backplane power supplies before installing or servicing the carrier unit.
- DIN Rail Mounting: Snap the carrier onto a standard 35 mm DIN rail in a vertical mounting orientation, ensuring the rear locking tab fully engages the rail lip.
- Earthing and Grounding: Ensure direct metal-to-metal contact with a grounded DIN rail to establish chassis grounding for transient suppression up to 300 VAC.
- Harness Connection: Align the 36-pin field harness connector carefully with the header on the carrier and press firmly until side retaining latches lock into position.
- Module Seating: Slide the corresponding VersaMax I/O module vertically into the carrier keying tracks until the backplane connector fully mates and latching mechanisms lock.
Additional Information
- 100% Genuine Parts: All products are original and authentic, ensuring reliable industrial performance.
- 30-Day Refund Guarantee: Return any in-stock item within 30 days in original, unopened packaging for a full refund (excluding shipping and fees).
- 12-Month Warranty: Covers defects in materials or workmanship; excludes misuse, normal wear, or unauthorized modifications.
- Worldwide Shipping: We ship via USPS, UPS, FedEx, and DHL. Delivery times vary by country and may be subject to customs or import fees.
- Support & Contact: Technical and warranty assistance is available anytime. Contact us here: Contact.
- Purchase Guidance: Check product specifications and compatibility carefully before ordering to ensure proper application.
Tech & Buying Guide
Demystifying the 5 Levels of Industrial Automation Architecture
Modern manufacturing relies on structured communication hierarchy to bridge physical shop-floor hardware with enterprise management software. This framework, commonly known as the Automation Pyramid, establishes how data flows between field devices, logic controllers, and corporate IT networks. Understanding these five distinct levels helps engineers and plant managers optimize system operations, reduce downtime, and implement seamless factory automation solutions.
Transforming Shop Floor Data into Actionable Insights: A Deep Dive into MES
Manufacturing Execution Systems serve as the digital backbone of modern factory floors. Positioned at Level 3 of the ISA-95 automation pyramid, MES links enterprise resource planning with real-time shop floor control systems. Today, industrial operators rely on MES software to bridge operational strategy with physical production execution.
