Skip to content

What are you looking for?


You may also like

12A0-0102-A1 GE Multilin UR Series Bus Board PCB12A0-0102-A1 GE Multilin UR Series Bus Board PCB12A0-0102-A1 GE Multilin UR Series Bus Board PCB
12A0-0102-A1 GE Multilin UR Series Bus Board PCB
12A0-0102-A1 GE Multilin UR Series Bus Board PCB
12A0-0102-A1 GE Multilin UR Series Bus Board PCB

12A0-0102-A1 GE Multilin UR Series Bus Board PCB


Only 10 left - Selling fast

PRODUCT SKU : 12A0-0102-A1

PRODUCT TYPE : Circuit Boards

PRODUCT VENDOR : General Electric


  • 100% Genuine Parts – Risk-Free 30-Day Returns
  • 1-Year Warranty & Expert Support for Every Order

Product Details

Configured for module-to-module inter-bus communication and internal power distribution in GE Multilin UR200 relay chassis, the GE 12A0-0102-A1 (12A0-0102 Bus Board PCB) provides direct physical/electrical execution.

Hardware Specifications

Parameter Specification
Model 12A0-0102-A1
Brand GE / GE Multilin
Origin USA
Dimensions Standard Multilin UR200 Chassis Interconnect PCB
Operating Temp -40 to +60 deg C
Power Consumption Passive Backplane Interconnect / Internal Bus Powered
System Platform GE Multilin UR Series / UR200 Relays
Board Type Internal Bus Board Printed Circuit Board
Connector Type Multi-pin High-Density Backplane Headers
Substrate Industrial FR-4 Multilayer PCB

Backplane Bus Communication Velocity and Firmware Flash Compatibility

The 12A0-0102-A1 bus board acts as the structural internal backplane for UR200 protection relays, routing parallel address, data, and diagnostic lines between CPU modules, I/O cards, and power supply units. By establishing fixed trace impedance and low-crosstalk signal routing, the assembly maintains deterministic backplane bus communication velocity across all populated card slots. The passive wiring matrix operates transparently to CPU software operations, preserving firmware flash compatibility across successive Multilin UR OS firmware updates and hardware card swaps.

Frequently Asked Questions

Q: How does the 12A0-0102-A1 board interface with inserted UR200 option modules?

A: Option cards slide directly along chassis guide rails to engage high-density edge connectors mounted on the front face of the 12A0-0102-A1 bus board.

Q: Is hot-swapping supported for modules connected through the 12A0-0102-A1 bus board?

A: Auxiliary control power to the UR200 chassis must be isolated prior to removing or inserting modules to prevent transient arcing across backplane power pins.

Field Installation Guidelines

  1. Disconnect all control power sources and isolate CT/PT secondary connections before opening the relay enclosure.
  2. Wear a grounded ESD wrist strap connected to the chassis ground terminal to prevent static discharge to the circuit trace matrix.
  3. Align the 12A0-0102-A1 bus board with the rear chassis mounting standoffs inside the empty UR200 rack enclosure.
  4. Fasten all board retention screws in an alternating pattern to eliminate mechanical stress across the solder joints.
  5. Inspect all backplane pin headers for pin alignment and freedom from debris prior to reinserting system cards.

Additional Information

  • 100% Genuine Parts: All products are original and authentic, ensuring reliable industrial performance.
  • 30-Day Refund Guarantee: Return any in-stock item within 30 days in original, unopened packaging for a full refund (excluding shipping and fees).
  • 12-Month Warranty: Covers defects in materials or workmanship; excludes misuse, normal wear, or unauthorized modifications.
  • Worldwide Shipping: We ship via USPS, UPS, FedEx, and DHL. Delivery times vary by country and may be subject to customs or import fees.
  • Support & Contact: Technical and warranty assistance is available anytime. Contact us here: Contact.
  • Purchase Guidance: Check product specifications and compatibility carefully before ordering to ensure proper application.




Recently Viewed Products

Tech & Buying Guide

Technical Insights, Installation Guides, and Buying Tips
Demystifying the 5 Levels of Industrial Automation Architecture

Demystifying the 5 Levels of Industrial Automation Architecture

Modern manufacturing relies on structured communication hierarchy to bridge physical shop-floor hardware with enterprise management software. This framework, commonly known as the Automation Pyramid, establishes how data flows between field devices, logic controllers, and corporate IT networks. Understanding these five distinct levels helps engineers and plant managers optimize system operations, reduce downtime, and implement seamless factory automation solutions.

Read more
Transforming Shop Floor Data into Actionable Insights: A Deep Dive into MES

Transforming Shop Floor Data into Actionable Insights: A Deep Dive into MES

Manufacturing Execution Systems serve as the digital backbone of modern factory floors. Positioned at Level 3 of the ISA-95 automation pyramid, MES links enterprise resource planning with real-time shop floor control systems. Today, industrial operators rely on MES software to bridge operational strategy with physical production execution.

Read more
Managed Switch vs. Unmanaged Switch: Industrial Ethernet Architecture

Managed Switch vs. Unmanaged Switch: Industrial Ethernet Architecture

Industrial Ethernet forms the backbone of factory automation. Selecting the right switch architecture determines system uptime, data throughput, and OT cyber resilience. This technical guide evaluates managed vs. unmanaged switches, analyzing operational differences, security controls, and selection criteria.
Read more