{"product_id":"dsrf-170-abb-masterpiece-equipment-frame","title":"DSRF 170 | ABB | MasterPiece Equipment Frame","description":"\u003cp\u003eThe \u003cstrong\u003eABB DSRF 170 57310255-AC\u003c\/strong\u003e serves as the primary \u003cstrong\u003eDSRF 170\u003c\/strong\u003e Equipment Frame utilized to execute structural module housing and backplane power distribution across MasterPiece platforms. The subrack provides direct physical alignment and multi-slot retention rails for active electronic plug-in cards, keeping internal wiring paths mechanically bound within exact tolerances.\u003c\/p\u003e\n\u003ch3\u003eHardware Specifications\u003c\/h3\u003e\n\u003cfigure class=\"table\"\u003e\n\u003ctable\u003e\n\u003cthead\u003e\n\u003ctr\u003e\n\u003cth\u003e\u003cstrong\u003eParameter\u003c\/strong\u003e\u003c\/th\u003e\n\u003cth\u003e\u003cstrong\u003eSpecification\u003c\/strong\u003e\u003c\/th\u003e\n\u003c\/tr\u003e\n\u003c\/thead\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003eModel\u003c\/td\u003e\n\u003ctd\u003eDSRF 170\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eBrand\u003c\/td\u003e\n\u003ctd\u003eABB\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eProduct ID\u003c\/td\u003e\n\u003ctd\u003e57310255-AC\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOrigin\u003c\/td\u003e\n\u003ctd\u003eSweden\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eWeight\u003c\/td\u003e\n\u003ctd\u003e8.0 kg net\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eDimensions\u003c\/td\u003e\n\u003ctd\u003eStandard subrack layout (Optimized for standard industrial cubicle mounting)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOperating Temp\u003c\/td\u003e\n\u003ctd\u003e0 to +55 deg C (Standard environment baseline)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePower Consumption\u003c\/td\u003e\n\u003ctd\u003ePassive chassis architecture (Distributes localized power rail loads)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eCore Function\u003c\/td\u003e\n\u003ctd\u003eCircuit board orientation, mechanical card slot retention, and backplane tracking\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eConstruction Type\u003c\/td\u003e\n\u003ctd\u003eOpen subrack frame configuration\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003c\/figure\u003e\n\u003ch3\u003eDeterministic Networks \u0026amp; I\/O Density Scaling\u003c\/h3\u003e\n\u003cp\u003eThe structural footprint dictates the physical capacity boundary for localized I\/O density scaling inside the automation cubicle. Circuit traces within the integrated backplane coordinate digital packets over Profinet \/ EtherNet\/IP deterministic networks by ensuring structural trace impedance matching. This multi-slot structural layout prevents geometric deflection of rear connector pins, preserving deterministic data scan cycles and maintaining firmware flash compatibility handshakes between adjacent active processing elements.\u003c\/p\u003e\n\u003ch3\u003eFrequently Asked Questions\u003c\/h3\u003e\n\u003cp\u003eQ: Does the structural layout of the DSRF 170 allow live hot-swap execution of active cards?\u003c\/p\u003e\n\u003cp\u003eA: The DSRF 170 is a passive mechanical enclosure with bus infrastructure. Live component extraction or insertion dependencies reside purely on the active electrical modules and terminal interfaces configured inside the subrack.\u003c\/p\u003e\n\u003cp\u003eQ: How is the common reference potential bonded across separate card slots on the chassis?\u003c\/p\u003e\n\u003cp\u003eA: Frame structural pieces are mechanically bridged to a copper grounding block located at the rear of the assembly. This terminal must be linked to the primary enclosure earth to establish common grounding paths.\u003c\/p\u003e\n\u003cp\u003eQ: What physical faults result from unexpected mechanical warping of the module rails?\u003c\/p\u003e\n\u003cp\u003eA: Mechanical distortion of the guide tracks causes uneven contact terminal stress at the backplane interface, increasing capacitance variation and causing signal packet drops across the internal communications network.\u003c\/p\u003e\n\u003ch3\u003eField Installation Guidelines\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003eBolt the frame housing securely onto the cabinet matrix assembly, verifying parallel plane orientation to prevent mechanical strain on the subrack components.\u003c\/li\u003e\n\u003cli\u003eMaintain an open vertical clearance zone of at least 100 mm above and below the chassis border to allow free thermal air draft flow from active circuits.\u003c\/li\u003e\n\u003cli\u003eEstablish a distinct low-impedance connection between the primary chassis ground stud and the master enclosure copper earth bar using a heavy-gauge braid before powering active components.\u003c\/li\u003e\n\u003cli\u003eEnsure all card retention fasteners are manually secured after card insertion to damp mechanical vibration components in long-term operation.\u003c\/li\u003e\n\u003c\/ul\u003e","brand":"ABB","offers":[{"title":"Default Title","offer_id":53054480744757,"sku":"DSRF170 57310255-AC","price":66.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0973\/7630\/5461\/files\/DSRF15057310255-A_c1b97c69-bee8-4fd4-af90-020e049ae80d.png?v=1782897758","url":"https:\/\/www.5gplc.com\/products\/dsrf-170-abb-masterpiece-equipment-frame","provider":"High Five PLC Solution Limited","version":"1.0","type":"link"}