{"product_id":"abb-dspc-172-master-cpu-module-exc57310001-ml","title":"ABB DSPC 172 Master CPU Module EXC57310001-ML","description":"\u003cp\u003eThe \u003cstrong\u003eABB DSPC 172 EXC57310001-ML\u003c\/strong\u003e, also cataloged as the \u003cstrong\u003eDSPC 172\u003c\/strong\u003e Central Unit, operates as a dedicated hardware component for high-speed master processing execution and control program computation within ABB Advant process control system platforms.\u003c\/p\u003e\n\u003ch3\u003eHardware Specifications\u003c\/h3\u003e\n\u003cfigure class=\"table\"\u003e\n\u003ctable\u003e\n\u003cthead\u003e\n\u003ctr\u003e\n\u003cth\u003e\u003cstrong\u003eParameter\u003c\/strong\u003e\u003c\/th\u003e\n\u003cth\u003e\u003cstrong\u003eSpecification\u003c\/strong\u003e\u003c\/th\u003e\n\u003c\/tr\u003e\n\u003c\/thead\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003eModel\u003c\/td\u003e\n\u003ctd\u003eDSPC 172\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePart Number\u003c\/td\u003e\n\u003ctd\u003eEXC57310001-ML\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eBrand\u003c\/td\u003e\n\u003ctd\u003eABB\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eProduct Type\u003c\/td\u003e\n\u003ctd\u003eCentral Units\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOrigin\u003c\/td\u003e\n\u003ctd\u003eSweden\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eWeight\u003c\/td\u003e\n\u003ctd\u003e0.9 kg\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eDimensions\u003c\/td\u003e\n\u003ctd\u003eStandard ABB subrack slot compatible\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOperating Temp\u003c\/td\u003e\n\u003ctd\u003e0 to +55 deg C\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePower Consumption\u003c\/td\u003e\n\u003ctd\u003e24 VDC (Backplane bus supplied)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eArchitecture\u003c\/td\u003e\n\u003ctd\u003eProcessor Board \/ Central Unit\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eWEEE Compliance\u003c\/td\u003e\n\u003ctd\u003eProduct Not in WEEE Scope\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003c\/figure\u003e\n\u003ch3\u003eDeterministic Backplane Bus Velocity and Firmware Flash Compatibility\u003c\/h3\u003e\n\u003cp\u003eThe processor architecture interfaces directly with the central backplane logic to maintain backplane bus communication velocity during real-time instruction execution. Onboard memory and bus processing circuits support firmware flash compatibility across varied controller operating software revisions, ensuring instruction decoding stability. Physical shielding and channel isolation design isolate core processing paths from backplane high-frequency electrical noise and field power line interference.\u003c\/p\u003e\n\u003ch3\u003eFrequently Asked Questions\u003c\/h3\u003e\n\u003cp\u003eQ: What precautions are required regarding backplane power during module replacement?\u003c\/p\u003e\n\u003cp\u003eA: Subrack power must be fully de-energized before removing or installing the DSPC 172 module to prevent electrical damage to backplane connector pins.\u003c\/p\u003e\n\u003cp\u003eQ: How is chassis ground continuity established for the DSPC 172 module?\u003c\/p\u003e\n\u003cp\u003eA: Chassis ground connection is established directly through the metal panel retaining screws when locked tightly into the structural subrack card cage.\u003c\/p\u003e\n\u003cp\u003eQ: What handling procedures must be followed to protect internal electronics?\u003c\/p\u003e\n\u003cp\u003eA: Maintenance personnel must utilize an anti-static wrist strap connected to structural ground prior to extracting the printed circuit assembly from its guide slot.\u003c\/p\u003e\n\u003ch3\u003eField Installation Guidelines\u003c\/h3\u003e\n\u003col\u003e\n\u003cli\u003eDe-energize all primary supply lines feeding the controller subrack chassis before mounting or extracting the DSPC 172 module.\u003c\/li\u003e\n\u003cli\u003eAlign the board edges accurately with the subrack card guide rails to prevent structural pin bending at the rear bus interface.\u003c\/li\u003e\n\u003cli\u003ePush the module evenly into the chassis slot until the backplane edge connector fully seats.\u003c\/li\u003e\n\u003cli\u003eSecure the top and bottom front panel screws to ensure mechanical stability and positive chassis grounding.\u003c\/li\u003e\n\u003cli\u003eMaintain a minimum physical isolation distance of 200 mm between adjacent high-voltage field power cables and subrack signal buses.\u003c\/li\u003e\n\u003c\/ol\u003e","brand":"ABB","offers":[{"title":"Default Title","offer_id":53250154299701,"sku":"DSPC 172 EXC57310001-ML","price":66.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0973\/7630\/5461\/files\/DSPC172EXC57310001-ML.png?v=1785898321","url":"https:\/\/www.5gplc.com\/products\/abb-dspc-172-master-cpu-module-exc57310001-ml","provider":"High Five PLC Solution Limited","version":"1.0","type":"link"}