{"product_id":"abb-dspc-170-57360001-gd-1-cpu-module","title":"ABB DSPC 170 57360001-GD\/1 CPU Module","description":"\u003cp\u003eThe \u003cstrong\u003eABB DSPC 170 57360001-GD\/1\u003c\/strong\u003e, also cataloged as the \u003cstrong\u003eDSPC170\u003c\/strong\u003e CPU Module, operates as a dedicated hardware component for central process execution and real-time control logic calculation within ABB Advant Master Process Control System networks.\u003c\/p\u003e\n\u003ch3\u003eHardware Specifications\u003c\/h3\u003e\n\u003cfigure class=\"table\"\u003e\n\u003ctable\u003e\n\u003cthead\u003e\n\u003ctr\u003e\n\u003cth\u003e\u003cstrong\u003eParameter\u003c\/strong\u003e\u003c\/th\u003e\n\u003cth\u003e\u003cstrong\u003eSpecification\u003c\/strong\u003e\u003c\/th\u003e\n\u003c\/tr\u003e\n\u003c\/thead\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003eModel\u003c\/td\u003e\n\u003ctd\u003eDSPC 170\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePart Number\u003c\/td\u003e\n\u003ctd\u003e57360001-GD\/1\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eBrand\u003c\/td\u003e\n\u003ctd\u003eABB\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eProduct Type\u003c\/td\u003e\n\u003ctd\u003eCPU Modules\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOrigin\u003c\/td\u003e\n\u003ctd\u003eUSA\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eWeight\u003c\/td\u003e\n\u003ctd\u003e0.915 kg\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eDimensions\u003c\/td\u003e\n\u003ctd\u003e297 x 229.5 x 31.5 mm\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOperating Temp\u003c\/td\u003e\n\u003ctd\u003e0 to +55 deg C\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePower Consumption\u003c\/td\u003e\n\u003ctd\u003e24 VDC (Backplane bus supplied)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eArchitecture\u003c\/td\u003e\n\u003ctd\u003eProcessor Board for ABB Advant Master\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eMounting Method\u003c\/td\u003e\n\u003ctd\u003eAdvant Master subrack chassis slot\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003c\/figure\u003e\n\u003ch3\u003eBackplane Bus Communication Velocity and Firmware Flash Compatibility\u003c\/h3\u003e\n\u003cp\u003eThe processor board interfaces directly with the Advant Master backplane bus structure to maximize backplane bus communication velocity during real-time instruction polling and I\/O data processing cycles. Built-in logic circuits provide firmware flash compatibility across systemic system software revisions, ensuring stable instruction set execution. Embedded data buffering and hardware isolation shield central processor operations from high-frequency electromagnetic noise present along distributed rack backplanes.\u003c\/p\u003e\n\u003ch3\u003eFrequently Asked Questions\u003c\/h3\u003e\n\u003cp\u003eQ: Can the DSPC170 CPU module be removed or inserted while the system rack is energized?\u003c\/p\u003e\n\u003cp\u003eA: No, extraction or insertion must be performed only after de-energizing the subrack power supply to prevent permanent damage to sensitive backplane bus edge contacts.\u003c\/p\u003e\n\u003cp\u003eQ: How is chassis grounding established for the DSPC170 module in the subrack?\u003c\/p\u003e\n\u003cp\u003eA: Grounding is secured mechanically when the front metal faceplate mounting screws are fully tightened to the structural card cage enclosure frame.\u003c\/p\u003e\n\u003cp\u003eQ: What precautions should be taken to prevent electrostatic discharge when handling the board?\u003c\/p\u003e\n\u003cp\u003eA: Technicians must wear a grounded ESD wrist strap before touching the PCB surface or pulling the module from its card slot guide rails.\u003c\/p\u003e\n\u003ch3\u003eField Installation Guidelines\u003c\/h3\u003e\n\u003col\u003e\n\u003cli\u003eDisconnect all main power sources to the subrack assembly prior to inserting or removing the DSPC170 card.\u003c\/li\u003e\n\u003cli\u003eAlign the top and bottom edges of the circuit board with the internal subrack slot guide tracks.\u003c\/li\u003e\n\u003cli\u003eSlide the module smoothly into the slot until the rear multi-pin connector fully mates with the backplane receptacle.\u003c\/li\u003e\n\u003cli\u003eTighten the front panel retaining screws to secure physical alignment and establish chassis earth ground continuity.\u003c\/li\u003e\n\u003cli\u003eEnsure field communication and power cables maintain a minimum clearance of 200 mm from backplane signal buses to minimize signal interference.\u003c\/li\u003e\n\u003c\/ol\u003e","brand":"ABB","offers":[{"title":"Default Title","offer_id":53250126643509,"sku":"DSPC 170 57360001-GD\/1","price":66.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0973\/7630\/5461\/files\/DSPC17057360001-GD.png?v=1785897491","url":"https:\/\/www.5gplc.com\/products\/abb-dspc-170-57360001-gd-1-cpu-module","provider":"High Five PLC Solution Limited","version":"1.0","type":"link"}