{"product_id":"500-0305-ge-d20m-series-single-slot-chassis","title":"500-0305 GE D20M Series Single-Slot Chassis","description":"\u003cp\u003eThe \u003cstrong\u003eGE 500-0305\u003c\/strong\u003e, also cataloged as the \u003cstrong\u003e500-0305\u003c\/strong\u003e Single-Slot Chassis, operates as a dedicated hardware component for physical card containment and electromagnetic shielding within D20M system architecture.\u003c\/p\u003e\n\u003ch3\u003eHardware Specifications\u003c\/h3\u003e\n\u003cfigure class=\"table\"\u003e\n\u003ctable\u003e\n\u003cthead\u003e\n\u003ctr\u003e\n\u003cth\u003e\u003cstrong\u003eParameter\u003c\/strong\u003e\u003c\/th\u003e\n\u003cth\u003e\u003cstrong\u003eSpecification\u003c\/strong\u003e\u003c\/th\u003e\n\u003c\/tr\u003e\n\u003c\/thead\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003eModel\u003c\/td\u003e\n\u003ctd\u003e500-0305\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eBrand\u003c\/td\u003e\n\u003ctd\u003eGE \/ GE Fanuc\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOrigin\u003c\/td\u003e\n\u003ctd\u003eUSA\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eWeight\u003c\/td\u003e\n\u003ctd\u003e2.6 kg\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eDimensions\u003c\/td\u003e\n\u003ctd\u003e782 x 356 x 835 mm\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOperating Temp\u003c\/td\u003e\n\u003ctd\u003e-20 to +70 deg C\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePower Consumption\u003c\/td\u003e\n\u003ctd\u003ePassive Enclosure (0 W Base Draw)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eSlot Capacity\u003c\/td\u003e\n\u003ctd\u003e1 Circuit Board \/ Module Slot\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eShielding Type\u003c\/td\u003e\n\u003ctd\u003eMetallic EMI \/ RFI Attenuation Enclosure\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eSystem Compatibility\u003c\/td\u003e\n\u003ctd\u003eD20M Substation Automation Platform\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003c\/figure\u003e\n\u003ch3\u003eBackplane Communication Velocity and Shielding Dynamics\u003c\/h3\u003e\n\u003cp\u003eThe 500-0305 enclosure maintains signal integrity across the backplane bus interface by suppressing high-frequency radio frequency interference (RFI) and electromagnetic interference (EMI). The metallic internal housing mitigates transient field cross-talk during rapid backplane bus communication velocity changes. Designed for optimized I\/O density scaling within compact panel layouts, the physical chassis structure preserves firmware flash compatibility paths by preventing ambient electrical noise from corrupting low-voltage onboard circuit components during high-voltage switching operations.\u003c\/p\u003e\n\u003ch3\u003eFrequently Asked Questions\u003c\/h3\u003e\n\u003cp\u003eQ: Does the 500-0305 single-slot chassis support live module replacement or hot-swapping?\u003c\/p\u003e\n\u003cp\u003eA: Hot-swapping depends on the specific circuit board installed. The physical chassis itself contains no active switching elements, but power to the sub-rack segment must be verified for voltage isolation prior to card insertion to prevent connector pin arcing.\u003c\/p\u003e\n\u003cp\u003eQ: How is chassis grounding established to maintain EMI\/RFI attenuation?\u003c\/p\u003e\n\u003cp\u003eA: Grounding is executed through dedicated metallic mounting tabs that must maintain direct copper-to-frame contact with the cabinet DIN-rail or mounting plate. Direct bond impedance should remain below 0.1 ohms to Earth ground.\u003c\/p\u003e\n\u003ch3\u003eField Installation Guidelines\u003c\/h3\u003e\n\u003col\u003e\n\u003cli\u003eUnpack the 500-0305 chassis and inspect external metallic surfaces for structural deformation or shipping damage.\u003c\/li\u003e\n\u003cli\u003ePrepare the mounting surface inside the industrial enclosure, ensuring all non-conductive paint is scraped clear around screw mounting holes to achieve direct metal-to-metal bonding.\u003c\/li\u003e\n\u003cli\u003eFasten the chassis securely using standard hardware, applying a minimum screw thread engagement of 5 full turns and torquing fasteners to 2.5 Nm.\u003c\/li\u003e\n\u003cli\u003eVerify that the ambient operating temperature inside the control panel remains within -20 to +70 deg C.\u003c\/li\u003e\n\u003cli\u003eInsert the D20M circuit board module into the chassis guide rails until the backplane connector fully seats into place.\u003c\/li\u003e\n\u003cli\u003eConnect external field signal wiring cables, maintaining a minimum physical separation distance of 200 mm from high-voltage AC power lines to avoid induced current noise.\u003c\/li\u003e\n\u003c\/ol\u003e","brand":"General Electric","offers":[{"title":"Default Title","offer_id":53271290052917,"sku":"500-0305","price":66.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0973\/7630\/5461\/files\/500-0305.png?v=1786496872","url":"https:\/\/www.5gplc.com\/products\/500-0305-ge-d20m-series-single-slot-chassis","provider":"High Five PLC Solution Limited","version":"1.0","type":"link"}