{"product_id":"12a0-0102-a1-ge-multilin-ur-series-bus-board-pcb","title":"12A0-0102-A1 GE Multilin UR Series Bus Board PCB","description":"\u003cp\u003eConfigured for module-to-module inter-bus communication and internal power distribution in GE Multilin UR200 relay chassis, the \u003cstrong\u003eGE 12A0-0102-A1\u003c\/strong\u003e (\u003cstrong\u003e12A0-0102\u003c\/strong\u003e Bus Board PCB) provides direct physical\/electrical execution.\u003c\/p\u003e\n\u003ch3\u003eHardware Specifications\u003c\/h3\u003e\n\u003cfigure class=\"table\"\u003e\n\u003ctable\u003e\n\u003cthead\u003e\n\u003ctr\u003e\n\u003cth\u003e\u003cstrong\u003eParameter\u003c\/strong\u003e\u003c\/th\u003e\n\u003cth\u003e\u003cstrong\u003eSpecification\u003c\/strong\u003e\u003c\/th\u003e\n\u003c\/tr\u003e\n\u003c\/thead\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003eModel\u003c\/td\u003e\n\u003ctd\u003e12A0-0102-A1\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eBrand\u003c\/td\u003e\n\u003ctd\u003eGE \/ GE Multilin\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOrigin\u003c\/td\u003e\n\u003ctd\u003eUSA\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eDimensions\u003c\/td\u003e\n\u003ctd\u003eStandard Multilin UR200 Chassis Interconnect PCB\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOperating Temp\u003c\/td\u003e\n\u003ctd\u003e-40 to +60 deg C\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePower Consumption\u003c\/td\u003e\n\u003ctd\u003ePassive Backplane Interconnect \/ Internal Bus Powered\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eSystem Platform\u003c\/td\u003e\n\u003ctd\u003eGE Multilin UR Series \/ UR200 Relays\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eBoard Type\u003c\/td\u003e\n\u003ctd\u003eInternal Bus Board Printed Circuit Board\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eConnector Type\u003c\/td\u003e\n\u003ctd\u003eMulti-pin High-Density Backplane Headers\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eSubstrate\u003c\/td\u003e\n\u003ctd\u003eIndustrial FR-4 Multilayer PCB\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003c\/figure\u003e\n\u003ch3\u003eBackplane Bus Communication Velocity and Firmware Flash Compatibility\u003c\/h3\u003e\n\u003cp\u003eThe 12A0-0102-A1 bus board acts as the structural internal backplane for UR200 protection relays, routing parallel address, data, and diagnostic lines between CPU modules, I\/O cards, and power supply units. By establishing fixed trace impedance and low-crosstalk signal routing, the assembly maintains deterministic backplane bus communication velocity across all populated card slots. The passive wiring matrix operates transparently to CPU software operations, preserving firmware flash compatibility across successive Multilin UR OS firmware updates and hardware card swaps.\u003c\/p\u003e\n\u003ch3\u003eFrequently Asked Questions\u003c\/h3\u003e\n\u003cp\u003eQ: How does the 12A0-0102-A1 board interface with inserted UR200 option modules?\u003c\/p\u003e\n\u003cp\u003eA: Option cards slide directly along chassis guide rails to engage high-density edge connectors mounted on the front face of the 12A0-0102-A1 bus board.\u003c\/p\u003e\n\u003cp\u003eQ: Is hot-swapping supported for modules connected through the 12A0-0102-A1 bus board?\u003c\/p\u003e\n\u003cp\u003eA: Auxiliary control power to the UR200 chassis must be isolated prior to removing or inserting modules to prevent transient arcing across backplane power pins.\u003c\/p\u003e\n\u003ch3\u003eField Installation Guidelines\u003c\/h3\u003e\n\u003col\u003e\n\u003cli\u003eDisconnect all control power sources and isolate CT\/PT secondary connections before opening the relay enclosure.\u003c\/li\u003e\n\u003cli\u003eWear a grounded ESD wrist strap connected to the chassis ground terminal to prevent static discharge to the circuit trace matrix.\u003c\/li\u003e\n\u003cli\u003eAlign the 12A0-0102-A1 bus board with the rear chassis mounting standoffs inside the empty UR200 rack enclosure.\u003c\/li\u003e\n\u003cli\u003eFasten all board retention screws in an alternating pattern to eliminate mechanical stress across the solder joints.\u003c\/li\u003e\n\u003cli\u003eInspect all backplane pin headers for pin alignment and freedom from debris prior to reinserting system cards.\u003c\/li\u003e\n\u003c\/ol\u003e","brand":"General Electric","offers":[{"title":"Default Title","offer_id":53272282104117,"sku":"12A0-0102-A1","price":66.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0973\/7630\/5461\/files\/12A0-0102-A1.png?v=1786513331","url":"https:\/\/www.5gplc.com\/products\/12a0-0102-a1-ge-multilin-ur-series-bus-board-pcb","provider":"High Five PLC Solution Limited","version":"1.0","type":"link"}